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Molex Receives 2009 DesignVision Award
February 19, 2009

Molex Incorporated is honored to announce its Impact backplane connector system has been named as a winner in the International Engineering Consortium’s (IEC) 2009 DesignVision Awards. The IEC announced the awards on February 3rd at DesignCon 2009 in Santa Clara, California. The Impact connector system was selected by the DesignCon 2009 Technical Program Committee, consisting of industry experts in the semiconductor and electronic design engineering community judging the design tools and products as unique and beneficial to the semiconductor industry. The IEC’s DesignVision Awards give tribute to the top design tools of today.

At over 25 Gbps data rates, Molex’s Impact backplane connector system provides significant channel performance headroom for both traditional backplane and midplane architectures. It pushes the speed and density envelope to meet the next generation requirements of server, storage, telecommunications, and data networking equipment. Molex continues to expand its Impact backplane connector family. It is now tooled and available in 2-, 3-, 4-, 5-, and 6-pair traditional backplane header and daughtercard connector versions that support differential signal densities up to 80 differential pairs per linear inch in less than 29mm total width, making it the fastest, densest backplane connector on the market today. The Impact connector system is available with a complete range of guidance, power, coplanar, mezzanine and high performance cable solutions.

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